Patents Represented by Attorney Robart A. Westerlund, Jr.
  • Patent number: 5407864
    Abstract: A process of manufacturing a semiconductor chip that has a connecting pad and is connected to a front side of a circuit board that has a conductive trace connected to a through-hole. An insulating adhesive layer, which has a hole corresponding to the pad, is interposed between the chip and the board so that the pad, the hole in the insulating layer and the through-hole in the board are aligned. A conductive material is applied into the through-hole from the back side of the board so as to fill the through-hole and connect the pad to the trace. The conductive material may be applied using a sputtering method, a screening method, an electroplating method or an evaporating method. The back side of the board is polished to remove conductive material which may have been applied on the back side of the board outside the through-hole.
    Type: Grant
    Filed: July 23, 1993
    Date of Patent: April 18, 1995
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Gu-Sung Kim