Patents Represented by Attorney Robert D. Adkins

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  • Bonding pad with circular exposed area and method thereof
    Patent number: 5366589
    Abstract: A bonding pad is covered by an passivation layer to provide insulation and anti-corrosion protection. The passivation layer over the bonding pad is etched away to expose a circular area of the bonding pad where the bonding wire is attached. By shaping the passivation layer on top of the metal area in the form of a smooth curvature, there are no sharp edges. The circular exposed metal area minimizes the electric field density produced by application of a high voltage to the bonding pad and thereby avoids breakdown of the passivation layer.
    Type: Grant
    Filed: November 16, 1993
    Date of Patent: November 22, 1994
    Assignee: Motorola, Inc.
    Inventor: Li-Hsin Chang