Abstract: An imaging device is disclosed that includes a drum platen having a recess. A loading mechanism for loading an absorber into the recess and a pen is configured to eject ink on the absorber while the absorber is in the recess.

Abstract: Embodiments of a cleaner are disclosed.

Abstract: A method is disclosed that scans a colored code using a scanner disposed internal a device. As setting of the device is then adjusted based on a color of the colored code.

Abstract: A method is disclosed for controlling a capacitive mat by energizing first and second nodes of the capacitive mat with opposite polarity, forming an image on the media, and reversing the polarity of the first and second nodes.

Abstract: A print cartridge temperature control apparatus and method are disclosed. In one embodiment, ink passes from a first chamber, across a printhead, and to a second chamber to control the temperature of the printhead.

Abstract: A fuser is disclosed that includes a pair of outer rollers with one or more inner rollers displaced within at least one of the outer rollers. Each inner roller may optionally have a convex outer surface.

Abstract: A conductive isolation member for electrophotography components is disclosed. In one embodiment, a cartridge for use in an image forming device includes a photosensitive drum, an electrophotography component, and a conductive isolation member electrically connected to the electrophotography component to permit discharge of static charge on the electrophotography component upon removal of the conductive isolation member.

Abstract: Semiconductor chip packages having molded plastic substrates and recessed I/O terminals are disclosed, along with methods of making such packages. In an exemplary embodiment, the molded plastic substrate includes a metal interconnect pattern and a plurality of indentations in a surface thereof. Each indentation may include at least one projection. The indentation and any projections therein are covered by a metal lining. A metal contact, which serves as an I/O terminal, is placed in each of the indentations and is fused to the metal lining thereof. A chip is mounted on the substrate and is electrically connected to the metal contacts by the interconnect pattern. The package further includes a lid or hardened encapsulant over the chip.

Abstract: Package embodiments for housing an electronic device are disclosed, along with methods of making and interconnecting the packages. The package body may be formed of an injection molded plastic encapsulant. The package body includes a cavity in which the electronic device is contained. A lid extends over the open end of the cavity. Metal leads extend from the package body. A first portion of each lead is at a lower surface of the package body, a second portion of each lead extends vertically adjacent to a peripheral side of the package body, and a third portion of each lead extends over the package lid at a top surface of the package. The package has a key formed in the lid or at the first surface of the package body. The key is adapted so as to engage a corresponding key hole in another package stacked therewith. Abutting leads of the stacked packages form an electrical connection between the packages.