Abstract: Provided is a laser light emitting device that has light sources of multiple wavelengths including an oscillation wavelength in a green region and the like, and that can be miniaturized. A metal wiring 4 is formed on a supporting substrate 5. A green LD 1 and a red LD 2 are bonded to the metal wiring 4. Each of the green LD 1 and the red LD 2 is a laser diode element formed of a semiconductor having a layered structure. One of a positive electrode and a negative electrode of the element is bonded to the metal wiring 4, and the other electrode is connected to a lead wire 6 or a lead wire 7. The green LD 1 is formed of a GaN-based semiconductor laser diode having a nonpolar plane or a semipolar plane as a main surface for crystal growth. The red LD 2 is formed of an AlInGaP-based semiconductor laser diode.

Abstract: A rack rail system engageable with a post of a rack. The rack rail system includes a rail assembly and a flange provided on at least an end of the rail assembly. The flange includes a pin insertable into an aperture of the post when the flange is adjacent to the post. The rack rail system further includes a clamp pivotably connected to the flange and movable from an open position and a closed position. The clamp receives both the post and the flange in the closed position.

Abstract: A surface laminar circuit board includes an insulating layer, and a signal ground conductive layer disposed on an upper surface of the insulating layer. The conductive layer has a hole formed therein. A photosensitive dielectric layer is disposed on an upper surface of the signal ground conductive layer. The dielectric layer has a photo micro-via formed therein. A signal trace is disposed on the photosensitive dielectric layer, and is electrically coupled with the signal ground conductive layer by way of the photo micro-via. A conductive pad is provided, which has a majority thereof within an area defined by an outer periphery of the hole. The conductive pad is electrically coupled with the signal trace. A surface mounted component is mounted on the conductive pad.

Abstract: An optical transceiver arrangement includes a retainer assembly. The retainer assembly includes at least one housing adapted to be coupled to a fiber optic cable, and at least one carrier assembly having a carrier, and a die chip attached to the carrier. The die chip has at least one active region. The optical transceiver arrangement further includes at least one optical coupler disposed within the housing for optically coupling the at least one active region to the fiber optic cable. The optical transceiver arrangement also includes a laminate assembly having the retainer assembly disposed thereon. The die chip is electrically coupled to the laminate assembly.

Abstract: A release latch includes a latch mechanism. The latch mechanism has a base, and an arm. The arm has one end attached to the base, and a free end. The latch mechanism further has a catch connected to the free end of the arm. The base is adapted to be attached to a first component, and the catch is adapted to releasably engage a second component to releasably hold the first component against the second component. The release latch further includes a release mechanism adapted to be attached to the first component, and being movable relative to the base. When the release mechanism is moved, the release mechanism engages the arm to move the arm, thereby causing the catch to disengage from the second component and allowing the first component to be moved away from the second component.

Abstract: A surface laminar circuit board includes an insulating layer, and a signal ground conductive layer disposed on an upper surface of the insulating layer. The conductive layer has a hole formed therein. A photosensitive dielectric layer is disposed on an upper surface of the signal ground conductive layer. The dielectric layer has a photo micro-via formed therein. A signal trace is disposed on the photosensitive dielectric layer, and is electrically coupled with the signal ground conductive layer by way of the photo micro-via. A conductive pad is provided, which has a majority thereof within an area defined by an outer periphery of the hole. The conductive pad is electrically coupled with the signal trace. A surface mounted component is mounted on the conductive pad.

Abstract: A tray for retaining disks includes first and second longitudinally extending, spaced apart, parallel rods. A plurality of support plates are directly attached to the rods. Each support plate has at least one notch formed therein for receiving a respective support member. A plurality of rails are attached to the support plates. At least three spaced apart wires are provided. Each wire is formed to have a zigzag configuration adapted to receive and support the disk at an outer peripheral edge thereof. One of the wires is disposed to contact the outer periphery of the disk at a position of zero degrees, another one of the wires is disposed to contact the outer periphery of the disk at a position less than 90 degrees, and a further one of the wires is disposed to contact the outer periphery of the disk at a position greater than 270 degrees.

Abstract: A cable tie includes a strap having first and second ends. A head is disposed on the first end. The head has a slot for receiving the second end so as to form the strap into a loop. The head further has an device for engaging the second end of the strap so as to retain the strap in the form of the loop. A hooking arrangement is connected to the head for engaging with a holding member when the hooking arrangement is pushed in a first direction. The hooking arrangement freely releases the holding member when the hooking arrangement is pulled in a second direction opposite to the first direction. The hooking arrangement allows the cable tie to be repeatedly attached to, and removed from, the holding member while the strap is retained in the form of the loop.

Abstract: An optical coupler and housing arrangement includes a housing portion adapted to receive an optical connector of a fiber optic cable, and further includes an optical coupler portion integrally formed with the housing portion. The optical coupler portion is adapted to transmit optical signals to and from the fiber optic cable. The optical coupler portion has a plurality of optical fibers for transmitting the optical signals. Each of the optical fibers extends from one end surface of the optical coupler portion to another end surface of the optical coupler portion. The housing portion has a recess for receiving the optical connector, with one of the end surfaces of the optical coupler portion forming a back surface of the recess.

Abstract: A coupling arrangement includes a vertical cavity surface emitting laser. A carrier has the vertical cavity surface emitting laser affixed thereto. An optical coupler is coupled to the vertical cavity surface emitting laser, and has a plurality of optical fibers which receive light emitted from the vertical cavity surface emitting laser. The vertical cavity surface emitting laser is separated from the optical coupler by a gap and is free of direct contact with the optical coupler. The gap is less than about 50 microns, and is greater than zero microns. A curable adhesive is disposed in the gap for coupling the vertical cavity surface emitting laser to the optical coupler. The adhesive has a viscosity that defines a size of the gap.

Abstract: A fiber optic arrangement includes a chip, and a first light emitter and a second light emitter formed on the chip. A guide is formed on the chip and in registration with an active region of the second light emitter. An optical fiber is coupled to the second light emitter for transmitting light from the second light emitter. The guide aligns the optical fiber relative to the active region of the second light emitter. A light-sensing device is provided. An optical element transmits light emitted from the first light emitter to the light-sensing device for controlling an output optical power of at least the second light emitter.

Abstract: An arrangement includes a chassis, and a first mating component disposed inside of the chassis. A second mating component is provided. The first mating component is removably connected to the second mating component. A sliding tab is connected to the chassis and is slidable in a linear direction from a first position to a second position. When the sliding tab is in the first position, the first mating component is free to be removed from the second mating component. When the sliding tab is in the second position, the first mating component is secured to the second mating component to prevent the removal of the first mating component from the second mating component.

Abstract: A cage for an electronic component includes two spaced apart cast walls, and a roof member and a floor member connected to the two spaced apart cast walls. The walls are substantially identical, and the roof member and the floor member are each formed of a damped metallic laminate panel.

Abstract: An electrical interface arrangement includes a buss bar having a longitudinal edge that is substantially smooth and free of conductive tabs. A conductive member is arranged adjacent to the longitudinal edge of the buss bar, and contacts the buss bar with at least 40 A-spots per inch, along substantially an entire length of the buss bar. A circuit board having a plurality of internal planes is provided, with at least one of the internal planes being an internal power plane, and with at least another one of the internal planes being an internal wiring plane having a plurality of conductive wirings. The circuit board further has an arrangement for electrically connecting the conductive member to the internal power plane without interfering with a placement of the conductive wirings, so that the circuit board and the buss bar are in electrical communication.

Abstract: An electromagnetic interference shielding arrangement, includes a duplex optical transceiver having a light-emitter and a light-receiver disposed adjacent to each other and at an end of the optical transceiver. A first electromagnetic interference shield covers a major portion of the optical transceiver. A tailstock has an aperture disposed in alignment with the end of the optical transceiver. A second electromagnetic interference shield is positionable to shield the end of the optical transceiver. The second electromagnetic interference shield includes a pipe formed from a conductive material. The pipe has two opposing openings, and an axis extending from one of the openings to the other of the openings. The pipe has a profile that corresponds to a profile of the end of the optical transceiver. A septum is attached to the pipe. The septum is formed from a conductive material. The septum is arranged to extend in a direction that is at an angle to the axis.

Abstract: A parallel-plugged planar sandwich arrangement for a computer system includes a first printed circuit board having a first electrical connector on a surface thereof, and a second printed circuit board having a second electrical connector on a surface thereof. The second electrical connector is electrically mated to the first electrical connector, to electrically couple the first printed circuit board to the second printed circuit board. A stiffener panel is disposed between the first printed circuit board and the second printed circuit board. A disengagement mechanism is attached to the panel and includes a cam assembly that has a cam rotatable about an axis of rotation, a cam pin projecting out from opposite sides of the cam and being coaxial with the axis of rotation, and a torsional helical spring disposed around the cam pin for automatically rotating the cam in a first direction. A handle is attached to the cam.

Abstract: A highly flame retardant plasticized polyvinyl chloride compound (PVC) comprises a mixture of dialkyl tetrachlorophthalate and dialkyl tetrabromophthalate and is characterized by an absence of brittleness, and substantial flexibility at low temperatures as required for PVC formed jackets and insulation for wire and cable products.

Abstract: Tagatose is added to an organ storage and preservative solution to reduce reperfusion injury of the organ during surgery and/or following removal of the organ from a subject.

Abstract: An enclosure arrangement includes a chassis, and a central electronics complex. The central electronics complex has a cage removably positioned within the chassis. The cage has an open top providing access into the interior of the cage. The central electronics complex also includes a backplane arranged in a horizontal position, and forming a floor of the cage. The backplane has at least one card slot on a surface thereof. The central electronics complex further includes at least one circuit board disposed in the interior of the cage and being removably received by the card slot. The circuit board is arranged in a vertical position so that a gravitational force helps retain the circuit board in the card slot. The cage is removably positioned within the chassis. At least one rail connects the cage to the chassis. The cage is disposed on the rail, and is guidable into the chassis using the rail.

Abstract: The present invention is directed to compositions for use as additives in the automotive industry, which compositions contain waste powder prime and a plasticizer selected from the group consisting of 2-ethylhexyl diphenyl phosphate, diisoheptyl phthalate, a linear phthalate based upon C7-C9 alcohols, a mixture of esters containing a minimum of 55 percent of diesters and a maximum of 20 percent dibenzoate, a mixture of esters containing a minimum of 60 percent of diesters and a maximum of 30 percent dibenzoate and dipropylene glycol dibenzoate and automotive sealants which contain waste powder prime, a plasticizer selected from the group consisting of 2-ethylhexyl diphenyl phosphate, diisoheptyl phthalate, a linear phthalate based upon C7-C9 alcohols, a mixture of esters containing a minimum of 55 percent of diesters and a maximum of 20 percent dibenzoate, a mixture of esters containing a minimum of 60 percent of diesters and a maximum of 30 percent dibenzoate and dipropylene glycol dibenzoate and automotive