Abstract: A method for making ion conducting films includes the use of primary inorganic chemicals, which are preferably water soluble; formulating the solution with appropriate solvent, preferably deionized water; and spray depositing the solid electrolyte matrix on a heated substrate, preferably at 100 to 400° C. using a spray deposition system. In the case of lithium, the deposition step is then followed by lithiation or addition of lithium, then thermal processing, at temperatures preferably ranging between 100 and 500° C., to obtain a high lithium ion conducting inorganic solid state electrolyte. The method may be used for other ionic conductors to make electrolytes for various applications. The electrolyte may be incorporated into a lithium ion battery.

Abstract: A multichip module comprises a flexible circuit having conductive patterns on its surface(s) to which microelectronic device(s) are attached. The flexible circuit is enclosed and supported by two rigid frames, which may further be provided with protective heat spreading covers. Contact pads on the rigid frame(s) may be configured to engage a mating socket or they may be solderable to a printed circuit board.

Abstract: An apparatus for depositing a solid film onto a substrate from a reagent solution includes reservoirs of reagent solutions maintained at a sufficiently low temperature to inhibit homogeneous reactions within the reagent solutions. The chilled solutions are dispensed through showerheads, one at a time, onto a substrate. One of the showerheads includes a nebulizer so that the reagent solution is delivered as a fine mist, whereas the other showerhead delivers reagent as a flowing stream. A heater disposed beneath the substrate maintains the substrate at an elevated temperature at which the deposition of a desired solid phase from the reagent solutions may be initiated. Each reagent solution contains at least one metal and either S or Se, or both. At least one of the reagent solutions contains Cu. The apparatus and its associated method of use are particularly suited to forming films of Cu-containing compound semiconductors.

Abstract: A security system for freight containers comprises: a locking device configured to reliably attach to the container and prevent unauthorized opening of the container doors; an electromechanical locking mechanism; and a GPS receiver so that unlocking may be authorized when the container is at a selected location. The system may further include a device to sense conditions affecting the container; and, a communication system to transmit the output of the sensing device to a system administrator located remotely. The locking and sensing devices may be capable of two-way communication with the system administrator. The system may include a visual display on the exterior of the container capable of displaying selected messages. The messages may be preprogrammed or may be changed as the container moves from one geographic location to another.

Abstract: A materials processing system comprises a thermal processing chamber including a heating source, a first noncontacting thermal measurement device positioned to measure temperature on a first area of the material being processed, and, a second noncontacting thermal measurement device positioned to measure temperature on a second area of the material being processed, the first device being relatively more sensitive to changes in surface emissivity than the second device. By comparing the outputs of the two devices, emissivity changes can be detected and used as a proxy for some physical change in the workpiece and thereby determine when the desired process has been completed. The system may be used to develop a process recipe, or it may be part of a system for real-time process control based on emissivity changes. Applicable processes include heating, annealing, dopant activation, silicide formation, carburization, nitridation, sintering, oxidation, vapor deposition, metallization, and plating.

Abstract: A security system for freight containers comprises: a locking device to reliably attach to the container and prevent unauthorized opening of the container doors; a sensing device to sense conditions affecting the container; and, a communication system configured to transmit the output of the sensing device to a system administrator located remotely from the container. The locking and sensing devices may be capable of two-way communication with the system administrator, whereby the administrator may interrogate the locking/sensing device at selected times. The locking device may contain a GPS receiver whereby its geographic location at various times may be monitored either continuously, periodically, or after a trip is completed. The system may include a visual display on the exterior of the container capable of displaying selected messages. The messages may be preprogrammed or may be changed as the container moves from one geographic location to another.

Abstract: An apparatus for depositing a solid film onto a substrate from a reagent solution includes reservoirs of reagent solutions maintained at a sufficiently low temperature to inhibit homogeneous reactions within the reagent solutions. The chilled solutions are dispensed through showerheads, one at a time, onto a substrate. One of the showerheads includes a nebulizer so that the reagent solution is delivered as a fine mist, whereas the other showerhead delivers reagent as a flowing stream. A heater disposed beneath the substrate maintains the substrate at an elevated temperature at which the deposition of a desired solid phase from the reagent solutions may be initiated. Each reagent solution contains at least one metal and either S or Se, or both. At least one of the reagent solutions contains Cu. The apparatus and its associated method of use are particularly suited to forming films of Cu-containing compound semiconductors.

Abstract: A microwave heating system comprises a microwave applicator cavity; a microwave power supply to deliver power to the applicator cavity; a dielectric support to support a generally planar workpiece; a dielectric gas manifold to supply a controlled flow of inert gas proximate to the periphery of the workpiece to provide differential cooling to the edge relative to the center; a first temperature measuring device configured to measure the temperature near the center of the workpiece; and, a second temperature measuring device configured to measure the temperature near the edge of the workpiece. The gas flow is controlled to minimize the temperature difference from center to edge, and may be recipe driven or controlled in real time, based on the two temperature measurements. The method is particularly useful for monolithic semiconductor wafers, various semiconducting films on substrates, and dielectric films on semiconducting wafers.

Abstract: A neutron detector comprises a gas-filled dielectric shell, preferably a glass balloon, having opposite electrodes. An electric field is established whereby ionizing particles may be detected via ionization and current flow in the gas, using a pulse height analyzer or other conventional means. The dielectric shell preferably has low gas permeability and a bulk resistivity in the range of 108 to 1017 ?-m, and is preferably in the millimeter to centimeter size range. Multiple balloons may be arranged in parallel or may be individually addressable by the detector electronics.

Abstract: A neutron detector has a volume of neutron moderating material and a plurality of individual neutron sensing elements dispersed at selected locations throughout the moderator, and particularly arranged so that some of the detecting elements are closer to the surface of the moderator assembly and others are more deeply embedded. The arrangement captures some thermalized neutrons that might otherwise be scattered away from a single, centrally located detector element. Different geometrical arrangements may be used while preserving its fundamental characteristics. Different types of neutron sensing elements may be used, which may operate on any of a number of physical principles to perform the function of sensing a neutron, either by a capture or a scattering reaction, and converting that reaction to a detectable signal. High detection efficiency, an ability to acquire spectral information, and directional sensitivity may be obtained.

Abstract: A parasitic power supply provides for drawing power for an auxiliary device from a set of sequentially driven loads. A typical source of power is a traffic signal wherein the power may be sequentially applied to red, green and yellow lamps. The design provides isolation between loads so no two loads will be powered through any single-point failure of the power supply. The device may further contain control elements such as time delays to make the system compatible with requirements of safety devices used in traffic control systems to sense burned-out bulbs, and to sense conflicts between lighting patterns that are supposed to be mutually exclusive. The device may be configured as a separate component, or it may be integrated into a traffic signal head or into any selected device intended for connecting to a traffic signal head. The invention is particularly suitable for standard systems operating nominally at 115 VAC, though other AC voltages, and direct-current supplies, can also be used.

Abstract: A multichip module comprises a multilayer substrate circuit having conductive patterns on its surface(s) to which microelectronic device(s) are attached. The conductive patterns include a series of electrical contacts adjacent to one edge of the substrate. The substrate is bonded to two rigid frames, one on each opposite surface. Each substrate has a series of castellations on one edge that are aligned and electrically connected to the respective contacts on the substrate, preferably by soldering. The castellations can serve as a self-aligning mechanism when the module is brought into contact with a low-profile pin array, and the module may be held in place on a motherboard by guide rails in a socket that engages the edges perpendicular to the castellated edge of the module. The module may further be provided with protective heat spreading covers.

Abstract: An apparatus for depositing a solid film onto a substrate from a reagent solution includes a reservoir of solution maintained at a low temperature to inhibit homogeneous reactions. The solution contains multiple ligands to control temperature stability and shelf life. The chilled solution is periodically dispensed onto a substrate positioned in a holder having a raised peripheral structure that retains a controlled volume of solution over the substrate. The solution is periodically replenished so that only the part of the solution directly adjacent to the substrate is heated. A heater maintains the substrate at an elevated temperature at which the deposition of a desired solid phase from the solution may be initiated. The apparatus may also dispense excess chilled solution to cool various components within the apparatus and minimize nucleation of solids in areas other than on the substrate. The apparatus is particularly suited to forming films of II-VI semiconductors.

Abstract: A multichip module comprises: a first rigid member defining one outer wall of a chamber; a second rigid member defining the opposite wall of the chamber; a sealable interface joining the first and second rigid members at their peripheries, whereby a hollow chamber is formed; a flex circuit having a plurality of integrated circuit chips disposed thereon, the flex circuit affixed to at least one of the first and second rigid members; electrical contacts at least partially extending outward through the sealable interface; and, a fluid inlet and a fluid outlet configured to permit fluid to flow through the chamber whereby heat generated by the integrated circuit chips may be removed from the module.

Abstract: A multichip module comprises a multilayer substrate circuit having conductive patterns on its surface(s) to which microelectronic device(s) are attached. A part of the substrate is flexible and bifurcated. Two rigid members are attached lengthwise, one on either side of the substrate, and the free ends of the bifurcation are reflexed respectively about these members and bonded to them. Electrodes are located on the bifurcations so that they will be exposed outwardly and/or downwardly after reflexing. The module may further be provided with protective heat spreading covers. The electrodes and rigid members may be configured to engage a mating socket or they may be solderable to a printed circuit board.

Abstract: An apparatus for depositing a solid film onto a substrate from a reagent solution includes a reservoir of reagent solution maintained at a sufficiently low temperature to inhibit homogeneous reactions within the reagent solution. The reagent solution contains multiple ligands to further control temperature stability and shelf life. The chilled solution is dispensed through a showerhead onto a substrate. The substrate is positioned in a holder that has a raised structure peripheral to the substrate to retain or impound a controlled volume (or depth) of reagent solution over the exposed surface of the substrate. The reagent solution is periodically or continuously replenished from the showerhead so that only the part of the solution directly adjacent to the substrate is heated. A heater is disposed beneath the substrate and maintains the substrate at an elevated temperature at which the deposition of a desired solid phase from the reagent solution may be initiated.

Abstract: A socket assembly for multichip in-line modules comprises: at least three parallel in-line sockets, one of which is an edge-card socket adapted to matably engage electrodes on the edge of a printed circuit board, and the others of which are module sockets adapted to accept multichip in-line modules; and, internal connections between respective pins in each of the parallel sockets, whereby signals from the printed circuit board may be simultaneously carried to each of the multichip in-line modules. Alternatively, a socket assembly for multichip in-line modules comprises: a substantially rigid housing structure; at least two parallel in-line sockets adapted to accept multichip in-line modules; a set of electrodes adapted for soldering to a printed circuit board; and, internal connections between respective pins in each of the parallel sockets and the set of electrodes, whereby signals from the printed circuit board may be simultaneously carried to each of the multichip in-line modules.

Abstract: A neutron detector has a volume of neutron moderating material and a plurality of individual neutron sensing elements dispersed at selected locations throughout the moderator, and particularly arranged so that some of the detecting elements are closer to the surface of the moderator assembly and others are more deeply embedded. The arrangement captures some thermalized neutrons that might otherwise be scattered away from a single, centrally located detector element. Different geometrical arrangements may be used while preserving its fundamental characteristics. Different types of neutron sensing elements may be used, which may operate on any of a number of physical principles to perform the function of sensing a neutron, either by a capture or a scattering reaction, and converting that reaction to a detectable signal. High detection efficiency, an ability to acquire spectral information, and directional sensitivity may be obtained.

Abstract: A thin multichip module comprises: a foldable frame comprising two rigid, substantially planar members capable of being folded together about a selected fold axis to form a substantially closed structure; a flex circuit having a plurality of integrated circuit chips disposed thereon, the flex circuit bonded to at least one of the planar members over at least a portion of each of their respective surfaces; and, electrodes on the module configured to be accessible to an external socket after the frame is closed. A method for making a thin multichip module comprises the steps of: a. attaching integrated circuit chips to a flex circuit; b. bonding the flex circuit to a foldable frame comprising two rigid, substantially planar members capable of being folded together about a selected fold axis to form a substantially closed structure; and, c. folding the frame approximately 180° about the fold axis.

Abstract: A multichip module comprises a multilayer substrate circuit having conductive patterns on its surface(s) to which microelectronic device(s) are attached. A part of the substrate is flexible and bifurcated. Two rigid members are attached lengthwise, one on either side of the substrate, and the free ends of the bifurcation are reflexed respectively about these members and bonded to them. Electrodes are located on the bifurcations so that they will be exposed outwardly and/or downwardly after reflexing. The module may further be provided with protective heat spreading covers. The electrodes and rigid members may be configured to engage a mating socket or they may be solderable to a printed circuit board.