Abstract: An assembly for mounting a heat-generating semiconductor to an associated heat sink whereby direct heat conducting contact is assured between the semiconductor body and the heat sink by an element which electrically isolates and insulates the semiconductor from the other components while at the same time locating and providing pressure to clamp the semiconductor on the heat sink. The present assembly provides good thermal contact and adapts to thermal expansion of the system during operation to assure the maintainance of the contact regardless of temperature changes within the device. The assembly comprises a heat-dissipating base element having plan dimensions which are larger than the plan dimensions of the semiconductor. A retainer member is formed of a dielectric material and has means for locating and retaining the semiconductor. The retainer member also includes a plurality of arms connected to the locating and retaining means.

Abstract: A camera for use with a photographic element having a plurality of the exposure frames each having a registration perforation arranged in a predetermined relationship one with each frame. The camera is provided with an improved registration or metering means which includes a fixed element extending into the film plane and disposed in the camera adjacent the exposure aperture in a similar predetermined relationship therewith as the registration perforations are to the exposure frames of the photographic element or film. A movable element adjacent the fixed element is arranged to engage the photographic element to move the photographic element out of the predetermined plane to disengage the registration perforation from the fixed element whereby the film moving means of the camera can move the next frame of the film to the exposure aperture where it is engaged at least by the fixed element.