Abstract: The cooling air flow path extends from a blower through a tapered input duct to a large plenum chamber which coaxially surounds and extends over the top of the deposition apparatus. From this plenum chamber cooling air flows coaxially downward over the surface of the quartz bell jar which forms the reaction chamber, and radially inward through the banks of radiant heater lamps coaxially surrounding the bell jar. Each bank of heater lamps is readily removed for servicing by being rotated into an open position about a pivot axis extending along one vertical edge. From the open position, the bank can be slid sideways in slots in the supports and removed from the apparatus.

Abstract: A hollow graphite susceptor for supporting semiconductor substrates during processing in epitaxial reactor systems. The susceptor has reduced wall thickness to provide lower thermal mass for rapid heating and high wafer throughput. Early failure of this thin-walled susceptor is avoided by providing a raised reinforcing boss on its interior surface in alignment with each recess on the exterior surface.

Abstract: A susceptor carrying semiconductor wafers for processing is suspended from a compliant attachment at its upper end and is lowered into a reaction chamber for processing. At the completion of processing, the susceptor is withdrawn vertically to permit a robot to unload the processed wafers and load unprocessed wafers. In order to fix the position of the susceptor during the loading operations, a support carriage is moved into position to engage the lower end of the susceptor. Noxious and corrosive chloride vapors are simultaneously withdrawn from the reaction chamber by a vacuum line attached to the support carriage.

Abstract: A susceptor carrying semiconductor wafers for processing is suspended from a compliant attachment at its upper end and is lowered into a reaction chamber for processing. At the completion of processing, the susceptor is withdrawn vertically to permit a robot to unload the processed wafers and load unprocessed wafers. In order to fix the position of the susceptor during the loading operations, a support carriage is moved into position to engage the lower end of the susceptor. Noxious and corrosive chloride vapors are simultaneously withdrawn from the reaction chamber by a vacuum line attached to the support carriage.