Abstract: A right angled header connector assembly including a main housing having a circuit board connecting face from which respective circuit board connecting portions protrude horizontally rearward and forward therefrom for reflow soldering to the circuit board and a transverse mating face. A subhousing is releasably attachable to the main housing to extend forward at the mating face surrounding the mating portions of the contact elements and in adjacent covering relation to the forward protruding circuit board connecting portions subsequent to the reflow soldering step. Release of the subhousing from the mating face, enables access to the forward protruding circuit board connecting portions for the reflow soldering step, unimpeded by said subhousing.