Abstract: A method and system are disclosed for detecting the end-point of an etching cycle utilizing an etching device, sensor strips, and one or more resistance measuring devices. First, one or more sensor strips are deposited onto a substrate material. Resistance measuring devices are electrically connected to the sensor strips. Thereafter, the sensor strips residing on the substrate material are etched alongside product material. As each sensor strip is etched, its resistance will increase in a predictable manner with respect to the amount of material eroded from its surface. The resistances of the sensor strips are measured in real time over the duration of the etching cycle. Finally, the resistances measured by the resistance measuring devices are used to track etch depth in real time, enabling the etch device operator to determine the precise point in time at which the end-point has been reached and the cycle should be terminated.