Abstract: A reaction chamber for a Rapid Thermal Processing (RTP) system contains an aperture to allow introduction and removal of the object to be processed. The cross sectional area of the aperture is significantly less than the cross sectional area of the reaction chamber. A method of flushing the reaction chamber, using a short time laminar flow of the flush gas, is used in combination with the aperture to increase the throughput of the RTP system.
Type:
Grant
Filed:
February 13, 1995
Date of Patent:
December 3, 1996
Assignee:
AST Elekronik
Inventors:
Zsolt Nenyei, Helmut Merkle, Andreas Tillmann