Patents Represented by Law Firm Roesch, Lynda E.
  • Solder composition
    Patent number: 4695428
    Abstract: A low temperature, lead-free, cadmium-free solder for joining metals, primarily copper tube or brass pipe and fittings. The solder composition, being free of lead and other known toxic metals, has a composition range of 0.5-4.0% antimony, 0.5-4.0% zinc, 0.1-3.0% silver, 0.1-2.0% copper and 86.8-98.8% tin, is especially adaptable for plumbing applications where solder joints are exposed to potable water.
    Type: Grant
    Filed: August 21, 1986
    Date of Patent: September 22, 1987
    Assignee: J. W. Harris Company
    Inventors: Richard E. Ballentine, Robert M. Henson