Abstract: An apparatus (10) for dispensing hot melt adhesives includes an air gap (100) in the adhesive manifold (16) of the dispenser (10). The apparatus (10) includes a heater (80), a temperature sensing device (RTD) (82) and adhesive passageway (84) located within the adhesive manifold (16) of the dispenser (10). The dispenser (10) delivers heated adhesive to a gun body (12) where it is applied to a substrate. The air gap (100) is interposed between the heater (80) and the adhesive passageway (84) and directs a majority of the heat generated by the heater (80) toward the gun body (12) and toward regions of the apparatus (10) needing additional heating. The air gap (100) enables a desired temperature gradient within the dispenser (100) to be maintained and prevents localized heating or cooling, thus decreasing the possibility that the adhesive will coagulate and plug the dispenser (10).