Abstract: A method is provided for forming a plurality of solder joints for electrically and mechanically coupling a printed circuit board (100) and a flexible circuit (101). Solder is applied to the connection surfaces of the printed circuit board (100), and the connection surfaces of the flexible circuit (101) are tinned. The circuit board (100) and flexible circuit (101) are then positioned so that the connections surfaces of each are in alignment and a gap exists between circuit board (100) and flexible circuit (101). The gap between circuit board (100) and flexible circuit (101) is precisely controlled and permits the solder of the printed circuit to be in contact with the connection surfaces of the flexible circuit (101). The solder is reflowed by applying heat by vapor phase condensation.

Abstract: A method and apparatus is provided for electrically and mechanically interconnecting electronic circuit assemblies or electronic modules. An integrated circuit (300) includes a plurality of leads (302) extending from a surface (305), each of the leads (302) having a seating portion (403) and a stem portion (402). A printed circuit board (400) includes a plurality of plated through holes (401) therein corresponding to the plurality of leads (302) extending from the integrated circuit (300). The steps of the method include positioning the printed circuit board (400) so that a lower surface (404) of the printed circuit board (400) rests on the seating portion (403) of the leads (302) of the integrated circuit (300), and so that the stem portion (302) of each of the leads are positioned within the corresponding plated through holes (401) in the printed circuit board (400).

Abstract: An optical interface includes at least two transmitters and receivers capable of transmitting and receiving, respectively, high bandwidth optical signals. A first transmitter/receiver assembly which includes at least one such transmitter and one such receiver is mounted inside a computer having a shell which maintains a hermetic seal. The transmitter and receiver of the first transmitter/receiver assembly face a transparent portion of the computer shell. A second transmitter/receiver assembly also includes at least one transmitter and receiver which are mounted outside the computer shell facing the transparent portion of the shell, with each transmitter and receiver of the second transmitter/receiver assembly opposite a corresponding receiver or transmitter of the first transmitter/receiver assembly. High bandwidth optical signals of up to 1 Gb/s are transmitted to and from the computer across the transparent portion of the shell while the hermetic seal is maintained.