Patents Represented by Attorney, Agent or Law Firm Ron Kaschak
  • Patent number: 7359378
    Abstract: A security system for a communication system that includes an IP network and groups of servers in a farm, wherein each group is associated with a customer. A user connected to the network can access information provided by a customer from a server within the group of servers associated with this customer through a dispatching device. The security system comprises setting means in each of the switches which are located between the dispatching device and the customer servers for setting a field of bits in the IP header of potentially irregular packets transmitted from a customer server and the dispatching device, means in the dispatching device for identifying any packet wherein the field of bits has been set to the predefined value, and means for deleting or logging the potentially irregular packet when the destination of the packet is not the dispatching device.
    Type: Grant
    Filed: October 2, 2002
    Date of Patent: April 15, 2008
    Assignee: International Business Machines Corporation
    Inventors: Jean-Marc Berthaud, Pascal Chauffour, Patrick Gayrard, Eric Lebrun
  • Patent number: 6236115
    Abstract: Chip stacks with decreased conductor length and improved noise immunity are formed by laser drilling of individual chips, such as memory chips, preferably near but within the periphery thereof, and forming conductors therethrough, preferably by metallization or filling with conductive paste which may be stabilized by transient liquid phase (TLP) processes and preferably with or during metallization of conductive pads, possibly including connector patterns on both sides of at least some of the chips in the stack. At least some of the chips in the stack then have electrical and mechanical connections made therebetween, preferably with electroplated solder preforms consistent with TLP processes. The connections may be contained by a layer of resilient material surrounding the connections and which may be formed in-situ. High density circuit packages thus obtained may be mounted on a carrier by surface mount techniques or separable connectors such as a plug and socket arrangement.
    Type: Grant
    Filed: July 29, 1999
    Date of Patent: May 22, 2001
    Assignee: International Business Machines Corporation
    Inventors: Michael Anthony Gaynes, Alan James Emerick, Viswanadham Puligandla, Charles Gerard Woychik, Jerzy Maria Zalesinski