Abstract: A method of forming isolation trenches in CMOS integrated circuits is disclosed. The trench side walls are covered by a thin oxide layer, and the trenches are filled with a highly doped polysilicon. The doped polysilicon has a high work function which prevents oxide charges from inverting the trench side walls and thereby turns off the parasitic transistors at these side walls to reduce latchup.
Type:
Grant
Filed:
December 22, 1989
Date of Patent:
January 12, 1993
Assignee:
North American Philips Corp., Signetics Division
Inventors:
Wayne I. Kinney, John P. Niemi, Jonathan E. Macro, David Back