Patents Represented by Attorney Ronald Kaschak

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  • Method and structure for an organic package with improved BGA life
    Patent number: 7148566
    Abstract: Ball Grid Array packages having decreased adhesion of the BGA pad to the laminate surface and methods for producing same are provided.
    Type: Grant
    Filed: March 26, 2001
    Date of Patent: December 12, 2006
    Assignee: International Business Machines Corporation
    Inventors: John U. Knickerbocker, Voya R. Markovich, Thomas R. Miller, William J. Rudik
  • Solder ball with chemically and mechanically enhanced surface properties
    Patent number: 6607613
    Abstract: A metal alloy solder ball comprising a first metal and a second metal, the first metal having a sputtering yield greater than the second metal. The solder ball comprises a bulk portion having a bulk ratio of the first metal to the second metal, an outer surface, and a surface gradient having a depth and a gradient ratio of the first metal to the second metal that is less than the bulk ratio. The gradient ratio increases along the surface gradient depth from a minimum at the outer surface. The solder ball may be formed by the process of exposing the ball to energized ions of a sputtering gas for an effective amount of time to form the surface gradient.
    Type: Grant
    Filed: February 1, 2001
    Date of Patent: August 19, 2003
    Assignee: International Business Machines Corporation
    Inventors: Frank D. Egitto, Edmond O. Fey, Luis J. Matienzo, David L. Questad, Rajinder S. Rai, Daniel C. Van Hart