Abstract: A shock and vibration isolating device is provided for mounting a component on a supporting structure while absorbing with substantially equalized reaction force relative movement between the component and the supporting structure occurring in all of the three mutually orthogonal planes in which the dynamic loading of the component can occur. The device includes an open frame planar spring element lying in a plane parallel to one of the mutually orthogonal planes, the spring element composed of a core member of a low creep, high modulus, metal and a shell member of a plastic exhibiting high internal dynamic loss substantially encompassing said core. A first cantilever section adjacent a first end is mounted to the supporting structure; a second cantilever section parallel to the first cantilever section adjacent a second end is mounted to the component; and a bridge section connects the first and second cantilever sections and is perpendicular thereto.

Abstract: Provided is a cooling system for transferring heat away from heat dissipative devices. The cooling system includes a thermally conductive heat sink member which is connected on one side to a heat dissipating device and attached on the second side to a resilient bellows pipe element filled with liquid coolant. The other end of the bellows is attached to and communicates with an evaporator section which communicates with a condenser section. The thermally conductive heat sink member, which may include thermally conductive fins, conducts transfers heat energy from the heat dissipating device to the liquid coolant. As the liquid coolant in the heat pipe heats and expands, the liquid in evaporator section of the cooling system can evaporate, the vapor passing to the condenser section. Vapor cools and returns to liquid state in the condenser section, wherein it is gravitationally returned to the evaporator section of the cooling device.

Abstract: A method for treating the surface of a solid to impart a desired degree of roughness by forming a large number of tiny indented points is disclosed. First, a large number of tiny liquid droplets is dispersed all over the surface of the solid. Then, a layer of a diluted solution of plastic dissolved in a volatile solvent is formed on the surface, covering the droplets. After the volatile solvent has evaporated, a plastic film containing a large number of tiny holes is formed on the surface of the solid. Etching is then done on the surface using the said plastic film as a mask, thus, a large number of tiny indented points are formed on the surface of the solid.

Abstract: Memory apparatus for simultaneously transferring data between corresponding memory cells of two RAMs is disclosed. The two memories are fabricated on a common integrated circuit chip substrate with the corresponding memory cells of the two memories positioned adjacent one another and interconnected through a pair of transfer transistors. The transfer transistors as well as the power supply to each memory cell are controllable to cause the simultaneous copying of the data from the cells of one RAM into the corresponding cells of the other RAM.

Abstract: A method and apparatus for monitoring transactions on a system bus for invalidate requests, including a queue for storing the invalidate requests which is divided into two parts. The first part of the queue is contained within a cache controller to ensure that an invalidate request is immediately available for processing when the cache controller is otherwise idle. The second part of the queue is contained within a system interface to ensure that the system interface can detect and respond to more system transactions before the first invalidate request has been processed and to enable the system interface to be immediately aware if the entire queue is full.

Abstract: An apparatus for controlling a plurality of electrical devices, each of the electrical devices including circuitry for switching the electrical device to a standby mode or an operational mode. A main control unit and a secondary control unit is provided in each of the electrical devices. When a main control unit of one electrical device is connected to a secondary control unit of a second electrical device, control of the operational state of the second electrical device is transferred to the remotely located first electrical device. When the two electrical devices are disconnected, local control of the second electrical device is maintained.

Abstract: A process for transferring data via DMA between a system resource and a controller via switching logic. During a setup write transaction, the switching logic is set up to enable DMA data to be transferred between a particular system memory and a selected system resource. The setup write transaction also is used to initialize the DMA byte counter. During a subsequent write transaction, DMA pointer registers are initialized with appropriate starting addresses. The controller then transmits a DMA start code and the system resource responds by transmitting an acknowledge code. At that time, DMA data is transmitted between the controller and the system resource via the switching logic.