Abstract: An embodiment of the invention in a quad flat no-lead package is described. The package is produced by encapsulating an integrated circuit chip, a die pad to which the chip is affixed, and leads which are connected to the chip in a molding compound. Leads are positioned on all four sides of the package, the exposed (bottom) portions of the leads are coplanar with the bottom of the package, and the leads do not extend, or extend only slightly, beyond the area of the package. The package includes a die pad also having an exposed (bottom) portion that is coplanar with the bottom of the package. The top portions of the leads are coplanar with the top surface of the die pad, and are flat.

Abstract: A method for changing a characteristic of a material is provided. The characteristic of the material is determined by the nature of the bond coupling certain molecular components in the material. The material is exposed to electromagnetic energy having a frequency range related to the bond coupling two molecular components in the material. During the time the material is exposed to the electromagnetic energy, stress is applied to the material. As a result, the bond is broken and then subsequently a different bond is formed by the simultaneous application of the stress and the electromagnetic energy. The structure of the new bond is determined in part by the stress.