Abstract: A composition and associated method for chemical mechanical planarization of a metal-containing substrate (e.g., a copper substrate) are described herein which afford high and tunable rates of metal removal as well as low dishing and erosion levels during CMP processing.
Type:
Grant
Filed:
December 8, 2009
Date of Patent:
August 28, 2012
Assignee:
Air Products and Chemicals, Inc.
Inventors:
Xiaobo Shi, Bentley J. Palmer, Rebecca A. Sawayda