Patents Represented by Attorney Rosalsen P. Morris-Oskanian
  • Patent number: 8252688
    Abstract: A composition and associated method for chemical mechanical planarization of a metal-containing substrate (e.g., a copper substrate) are described herein which afford high and tunable rates of metal removal as well as low dishing and erosion levels during CMP processing.
    Type: Grant
    Filed: December 8, 2009
    Date of Patent: August 28, 2012
    Assignee: Air Products and Chemicals, Inc.
    Inventors: Xiaobo Shi, Bentley J. Palmer, Rebecca A. Sawayda