Abstract: A multilayer type electronic part includes a laminated structure formed by stacking a plurality of first and second ceramic layers, the first ceramic layers being provided with internal electrode patterns on top thereof, the second ceramic layers having no internal electrode pattern and being located at a top and a bottom portions of the laminated structure, respectively, the internal electrode patterns being connected to each other to form a coil inside the laminated structure, a pair of external electrodes provided at two opposing sides of the laminated structure and connected to the coil. The multilayer type electronic part further includes one or more third ceramic layers, each of the third ceramic layers not including internal electrode pattern and being interposed between the first ceramic layers, and means for connecting the internal electrode patterns formed on the first ceramic layers to form the coil.