Abstract: An improved illuminated display system is disclosed which can be positively and accurately assembled with a plurality of low profiled illuminated indicator units to display a wide variety of input information. The illuminated indication is provided by a plurality of light emitting diodes inserted in edgewise fashion into slots in flat flexible circuitry with the remaining components attached thereto in conventional fashion. The circuit assembly is folded into containers to form the individual indicator units which are likewise, preferably, inserted into apertures in high current flat flexible circuitry to make wiping contact with the conductors thereof. The subject system obviates the prior art requirement for working in cramped spaces behind panels by providing the means to connect the indicator units of a display to associated circuitry from the front of the panel thereby producing a low profiled display panel.

Abstract: A solvent method for the metallization of a non-conductive surface with gold, nickel or copper is shown whereby on a substrate a thermosensitive coordination complex of palladium is deposited; the complex has the formula LmPdXn wherein L is a ligand or unsaturated organic radical, X is a halide, alkyl group or a bidentate ligand and m is an integer from 1 to 4 and n is from 0 to 3; trimethyl phosphite palladium dichloride complex is an appropriate illustration of the complex; the palladium complex is applied on the substrate in a suitable non-aqueous solution such as tetrahydrofuran solution; the complex is then baked in air at elevated temperature; the exposure to high temperature decomposes the complex leaving a residue which is catalytic to the deposition of gold, nickel, cobalt or copper from an electroless bath thereof; the non-conductive material is then immersed in an electroless bath to metallize the areas which have been rendered catalytic; the preferred thermosensitive coordination complex of pallad

Abstract: An improved slotted beam type electrical contact for engaging stranded wire is disclosed. The subject contact includes an insulation displacement feature which obviates the need for stripping the end of wire. It also assures good electrical and mechanical connection with the individual strands of the wire, regardless of the stranding or the lay of the strands, by the arrow head shape of the slot. The beams are retained in contact with the strands of wire by locking legs which, after the engagement of a stranded wire conductor therein, are deformed to prevent subsequent spreading of the beams.

Abstract: A narrow lead contact is disclosed for face down bonding of electronic chips, such as light emitting diodes. The narrow lead and the circuitry associated with the chip or diode is formed on a thin film of transparent insulating material in a conventional manner. The chip is placed face down on the lead on the film and bonded thereto. The bonding can be accomplished by known methods including solder reflow or conductive epoxys. A second lead, which may include a reflector in the case of a light emitting diode, is attached to another point on the chip. When the chip is a light emitting diode, the chip assembly can be encapsulated in a lens system which is attached to both sides of the film. Most of the light emitted from the back and sides of the diode is thus passed out through the film and lens system since the thin lead will preferably obscure less than 35% of the face of the diode. The circuitry formed on the thin film may contain an adjustable resistance to compensate for variations in light intensity.

Abstract: A shunt assembly is disclosed for interconnecting closely spaced terminal contacts. The contacts of the subject shunt are strip formed in a conventional fashion with a shunting bar interconnecting adjacent pairs of contacts. The required number of contacts are cut from the carrier strip and the interconnecting shunting bars are bent to a folded configuration thereby drawing the contacts closer together to achieve the desired spacing. The closely spaced contacts can be inserted into an appropriate housing of insulating material if so desired.