Abstract: A fiber optic fan-out module has a channel for receiving a fiber optic cable and a groove adjacent the channel for receiving protective filaments from the cable. The module further has an anchor block with a passage therethrough for receiving a loose protective sleeve assembly. The anchor block has a groove for receiving protective filaments from the sleeve assembly.
Type:
Grant
Filed:
October 17, 1988
Date of Patent:
December 5, 1989
Assignee:
Minnesota Mining and Manufacturing Company
Abstract: A stress sensitive semiconductor die and housing means therefore comprising a ceramic base member having a recessed portion and a shoulder portion around the periphery. A washer-like support member is positioned within the recess, one face of which is bonded to the base member, said support member having a central aperture. A stress sensitive semiconductor die is bonded to the other face of the support member with the center of the die being in substantial register with the aperture in the support member. Finally, cover means are attached to the shoulder portion.