Abstract: A metal composite comprising a substrate having a uniformly, mildly etched surface of an aluminum alloy, e.g. an alloy, consisting of at least about 99 wt. % aluminum, and the balance comprising specified quantities of silicon, iron, copper, manganese and zinc, and a uniformly adhering, electrocathodically deposited copper foil. The resulting peel strength between the aluminum alloy surface and the copper foil, after lamination of the composite to a resinous substrate under heat and pressure is within the range of from about 6 to about 8 lbs./in. of width of copper foil. This can be reduced to a value within the range of about 0.3 to about 2 lbs./in. of width by overplating the copper foil with a layer of zinc or indium. The resinous substrate may be a glass fiber reinforced epoxy resin, such as is used in the manufacture of printed circuit boards.