Abstract: A method and apparatus for fabricating a three dimensional array of semiconductor chips is disclosed. The method uses a multiple step fabrication process that automates the surface mounting of semiconductor chips with unique chip carriers to achieve the three dimensional array of chips. The method includes a step of depositing solder on a multitude of chip carriers at one time, placing the chip carriers with chips on a printed circuit board and then running the board with chips and carriers arranged in a three dimensional array through a single reflow oven to complete a single reflow process to permanently connect all of the components. The apparatus includes a unique chip carrier pallet and print fixture pedestal that work in combination to position the chip carriers for the automatic deposition of solder on a multitude of carriers at once and then position them for addition to the circuit board.

Abstract: The present invention relates to the field of motion/movement sensors, detectors, and/or monitors, as well as other types of sensors. In particular, the present invention may provide, for example, a large pulsed output voltage in response to very low (or slow) sensed movement or environment changes, such as, temperature, pressure, and energy. The present invention relates, for example, to other available sensors and may provide an output high enough to turn on related processing circuitry from an “OFF” state. The present invention relates, among other things, to sensing various events via, for example, axially poled homopolymer polyvinyladine fluoride (PVDF) or other piezoelectric materials.

Abstract: An apparatus and method is disclosed that allows for the arranging in a three dimensional array semiconductor chips on a circuit board. A unique chip carrier is disclosed on which any IC chip can be positioned on above the other on a circuit board. Additionally, the carrier allows for the testing of IC chips on the carrier and underneath it without having to remove the carrier and chips from the system even if they are of the BGA or CSP type. The carrier includes exposed test points to allow an on site test.

Abstract: The present invention relates to the field of battery and capacitor charging. In particular, the present invention provides pulsed current charging using changes, regardless of polarity, in the local energy environment to obtain power. The present invention relates, for example, to ambient energy charging thin film batteries, other batteries, or capacitors, via, for example, polyvinyladine fluoride homopolymer (PVDF), PVDF bi-axially poled, or other piezoelectric materials. Ambient energy may be defined as any change in energy within the local environment. Charging can be accomplished with, and is not limited to, positive or negative changes of the following energy types: thermal; visible light, including infrared and ultraviolet; mechanical motion or impact; triboelectric, including airflow or physical contact; movement in relation to a gravitational plane (increase or decrease in gravitational potential energy); and radio frequency (RF) electromagnetic energy, regardless of specific frequency.

Abstract: The present invention relates to the field of motion/movement sensors, detectors, and/or monitors, as well as other types of sensors. In particular, the present invention may provide, for example, a large pulsed output voltage in response to very low (or slow) sensed movement or environment changes, such as, temperature, pressure, and energy. The present invention relates, for example, to other available sensors and may provide an output high enough to turn on related processing circuitry from an “OFF” state. The present invention relates, among other things, to sensing various events via, for example, axially poled homopolymer polyvinyladine fluoride (PVDF) or other piezoelectric materials.

Abstract: The present invention provides recombinant respiratory syncytial viruses (RSV) in which all of the surface glycoprotein genes encoding the attachment protein G, the fusion protein F, and the Small Hydrophobic protein SH are deleted. The genes are replaced by a chimeric gene encoding a heterologous entry protein derived from the Vesicular Stomatitis Virus G protein or GP64 of baculovirus. Alternatively, the replacement proteins are provided in trans. Marker genes such as those encoding ?-glucuronidase (GUS) and green fluorescent protein (EGFP) are also added to the upstream and downstream side of the hybrid gene for easy detection. These infectious recombinant respiratory syncytial viruses offer alternatives and improvements as vaccine candidates.

Abstract: A novel method for production of and an apparatus for an encapsulated solid-state electrochemical device is disclosed. The present invention provides for electrical devices, such as, for example, thin-film batteries with sensitive chemistries that can survive environmental exposure while providing external electrical contact to the internal cell chemistry. The method of packaging of the present invention may include bonding one or more protective multi-layer laminates to the environmentally sensitive surfaces of an electronic device. The present invention may provide the advantage of avoiding entrapped air beneath the laminates.

Abstract: An improved multi-chip module includes a main circuit board having an array of electrical interconnection pads to which are mounted a plurality of IC package units. Each IC package unit includes a pair of IC packages, both of which are mounted on opposite sides of a package carrier. The package units may be mounted on one or both sides of the main circuit board. A first primary embodiment of the invention employs a laminar package carrier having a pair of major planar surfaces. Each planar surface incorporates electrical contact pads. One IC package is surface mounted on each major planar surface, by interconnecting the leads of the package with the contact pads on the planar surface, to form the IC package unit. Several different variations of the chip module are disclosed.