Abstract: Systems and methods are described herein to virtualize functions and decentralize services in a flat-graph network of client devices. Other embodiments include apparatus and systems of devices comprising virtual node modules to perform a variety of service functions. Further embodiments include methods for overlaying service functions on a flat-graph network of client devices.

Abstract: A circuit to reduce noise spikes on the power and ground rails of a chip when switching over an input-output bus, the circuit comprising an encoder to encode a word before transmission over the input-output bus so that the difference in the number of 1 bits and the number of 0 bits in the encoded word is upper bounded, where the upper bound is less than the length of the original word before encoding. An embodiment circuit to implement this encoding comprises partitioning the word into a plurality of smaller words. An embodiment circuit further comprises a number of stages, where in the first stage, there are a plurality of encoders to encode in pair-wise fashion the smaller words. Additional stages also comprise a plurality of encoders, each encoder performing a pair-wise encoding of words outputted by a previous stage. Other embodiments are described and claimed.

Abstract: Some embodiments of the invention include an interconnect structure having a plurality of connector circuits to transfer messages among a number of devices. Each of the connector circuits includes a data transfer unit to transfer messages and a clock unit to provide timing to transfer the messages. The interconnect structure propagates a master clock signal serially through the clock units of the connector circuits to generate a number of different input clock signals. The timing provided by each of the clock units is based on the timing of one of the input clock signals. Other embodiments are described and claimed.

Abstract: A electronic device and method for extracting heat from a heat producing component having front and back sides, the front side is disposed across from the back side, and the front side is attached to a substrate including multiple holes. A thermal interface material is disposed over the back side of the heat producing component. A heat sink including multiple pins corresponding to the multiple holes in the substrate is disposed over the thermal interface material such that the pins are disposed through the holes. The thermal interface material melts and wets to form a thermal coupling between the back side and the heat sink when passed over pre-heaters of a wave soldering machine. Further, the pins are soldered to form solder joints between the respective pins and the substrate when passed over a solder wave in the wave soldering machine to lock-in the thermal coupling formed during the preheating of the thermal interface material to provide a low-cost thermal solution.