Abstract: A system for programming one or more hearing aids with a host computer, the system including a hearing aid programmer for wireless communications with the host computer. In various embodiments, the hearing aid programmer has at least one interface connector for communication with at least one hearing aid. Additionally, in various embodiments, the system includes a wireless interface adapted for connecting to the at least one interface connector of the hearing aid programmer, the wireless interface further adapted for wireless communication with one or more hearing aids. Varying embodiments of the present subject matter include a wireless interface which contains signal processing electronics, a memory connected to the signal processing electronics; and a wireless module connected to the signal processing electronics and adapted for wireless communications.
Type:
Grant
Filed:
September 3, 2009
Date of Patent:
April 19, 2011
Assignee:
Micro Ear Technology, Inc.
Inventors:
Lawrence T. Hagen, David A. Preves, James Newton, Garry Richardson
Abstract: Methods and materials for silicon on insulator wafer production in which the doping concentration in a handle wafer is sufficiently high to inhibit dopant from diffusing from the bond wafer during or after bonding to the handle wafer.
Type:
Grant
Filed:
May 9, 2006
Date of Patent:
December 8, 2009
Assignee:
Atmel Corporation
Inventors:
Gayle W. Miller, Thomas S. Moss, Mark A. Good