Abstract: A double-gate field effect transistor (DGFET) is provided using a damascene-like replacement gate processing step to create sidewall source/drain regions, oxide spacers and gate structures inside a previously formed trench. The damascene-like replacement gate processing step allows for the fabrication of a tapered transistor body region having a thicker body under the contacts which reduces access resistance.
Type:
Grant
Filed:
April 11, 2003
Date of Patent:
July 13, 2004
Assignee:
International Business Machines Corporation
Inventors:
Kevin K. Chan, Erin C. Jones, Paul M. Solomon, Hon-Sum Phillip Wong