Patents Represented by Attorney, Agent or Law Firm Scully, Murphy Murphy & Presser
  • Patent number: 6333141
    Abstract: The invention relates to a process for forming an integrated circuit device comprising (i) a substrate; (ii) metallic circuit lines positioned on the substrate and (iii) a dielectric material positioned on the circuit lines. The dielectric material comprises porous organic polysilica.
    Type: Grant
    Filed: July 8, 1998
    Date of Patent: December 25, 2001
    Assignee: International Business Machines Corporation
    Inventors: Kenneth Raymond Carter, Richard Anthony Dipietro, Craig Jon Hawker, James Lupton Hedrick, Victor YeeWay Lee, Robert Dennis Miller, Willi Volksen, Do Yeung Yoon