Patents Represented by Attorney, Agent or Law Firm Scully, Scott, Nurphy & Presser
  • Stress-relieving heatsink structure and method of attachment to an electronic package
    Patent number: 6830960
    Abstract: A stress-relieving heatsink structure and method of forming thereof for an electronic package, for instance, that including a semiconductor chip package which is mounted on a wired carrier, such as a circuitized substrate. The heatsink structure is constituted from a plurality of base structures which are joined along slits so as to impart a degree of flexibility to the electronic package inhibiting the forming of stresses tending to cause delamination of the package components.
    Type: Grant
    Filed: August 22, 2002
    Date of Patent: December 14, 2004
    Assignee: International Business Machines Corporation
    Inventors: David J. Alcoe, Randall J. Stutzman