Abstract: A seepage system for an injection molding apparatus includes a manifold plate with a first portion and a second portion abutting the first portion, and a seepage passage positioned between the first and second portions. The second portion may have at least a portion of a melt passage, and the seepage passage may have an outlet. The seepage system also has one or more seepage channels, with each seepage channel being connected to and in communication with the seepage passage. Moreover, the seepage system includes one or more seepage bores for receiving the flow of excess material, with each seepage bore being connected to and in communication with one of the seepage channels. Gravity is used to assist the flow of excess material from the one or more seepage bores through the seepage channels and the seepage passage.