Abstract: A method for reducing adhesive build-up on ultrasonic bonding surfaces of ultrasonic bonding systems is disclosed. The method includes providing an ultrasonic bonding surface. A pad is provided proximate to, and in fluid contact with, the ultrasonic bonding system. A fluid is conducted to the pad such that the fluid is applied is intermittently or continuously applied to at least a portion of the ultrasonic bonding surface.
Type:
Grant
Filed:
December 19, 2001
Date of Patent:
December 16, 2003
Assignee:
Kimberly-Clark Worldwide, Inc.
Inventors:
Chinmay Suresh Betrabet, Davis Hoang Nhan, Barton Andrew Laughlin, Daniel Hoo, James Melvin Gaestel