Patents Represented by Attorney Sharon K. Brady
-
Patent number: 8053517Abstract: This invention pertains to neutralized silicone elastomer dispersions and methods for making neutralized silicone elastomer dispersions. This invention also pertains to compositions comprising the neutralized silicone elastomer and an acid reactive compound. The silicone elastomer dispersion are neutralized typically by blending the silicone elastomer dispersion with a base such as sodium bicarbonate or by adding a basic neutralizing agent to one or more of the raw materials used to make the silicone elastomer dispersion and removing the basic neutralizing agent by filtration or any other suitable means.Type: GrantFiled: January 8, 2008Date of Patent: November 8, 2011Assignee: Dow Corning CorporationInventors: Donald Anthony Kadlec, Victor Albert Raul, William James Schulz, Jr.
-
Patent number: 7914645Abstract: A silicone adhesive composition used for adhering a device or a substance to a wet surface contains (i) a silicone resin that is cohydrolysis product of a trialkyl hydrolyzable silane and an alkyl silicate in which the cohydrolysis product contains a plurality of silicon-bonded hydroxy groups; (ii) a linear organopolysiloxane fluid containing terminal silicon-bonded hydroxy groups having a viscosity above 200,000 mm2/s at 25° C.; (iii) a trialkylsiloxy terminated polyorganosiloxane fluid having a viscosity of 100,000-600,000 mm2/s at 25° C.Type: GrantFiled: January 3, 2007Date of Patent: March 29, 2011Assignee: Dow Corning CorporationInventors: Gerald Kenneth Schalau, II, Xavier Jean-Paul Thomas, Victor Albert Raul, David Clayton Gantner, Katherine Lynn Ulman
-
Patent number: 7838615Abstract: A siloxane resin having the formula: (HSiO3/2)a(RSiO3/2)b(SiO4/2)c where R is Z, Z(CH2)n or ZO(CH2)n where Z is a phenyl or substituted phenyl group; n has a value of 1 to 6, a has value of 0.01 to 0.7, b has a value of 0.05 to 0.7, c has a value of 0.1 to 0.9 and a+b+c?1. The siloxane resins are useful in anti-reflective coating compositions.Type: GrantFiled: September 23, 2005Date of Patent: November 23, 2010Assignee: Dow Corning CorporationInventor: Bianxiao Zhong
-
Patent number: 7833696Abstract: Silsesquioxane resins useful in forming the antireflective coating having the formula (PhSiO(3-x)/2(OH)x)mHSiO(3-x)/2(OH)x)n(MeSiO(3-x)/2(OH)x)p(RSiO(3-x)/2(OH)x)q where Ph is a phenyl group, Me is a methyl group, R is selected from ester groups and polyether groups, x has a value of 0, 1 or 2; m has a value of 0.05 to 0.95, n has a value of 0.05 to 0.95, p has a value of 0.05 to 0.95, q has a value of 0.01 to 0.30 and m+n+p+q?1.Type: GrantFiled: September 29, 2005Date of Patent: November 16, 2010Assignee: Dow Corning CorporationInventors: Peng-Fei Fu, Eric Scott Moyer, Craig Rollin Yeakle
-
Patent number: 7756384Abstract: A method of forming an antireflective coating on an electronic device comprising (A) applying to an electronic device an ARC composition comprising (i) a silsesquioxane resin having the formula (PhSiO(3-x)/2(OHx)m HSiO(3-x)/2(OH)x)n, where Ph is a phenyl group, x has a value of 0, 1 or 2; m has a value of 0.05 to 0.95, n has a value of 0.05 to 0.95 and m+n?1; and (ii) a solvent; and (B) removing the solvent and curing the silsesquioxane resin to form an antireflective coating on the electronic device.Type: GrantFiled: September 29, 2005Date of Patent: July 13, 2010Assignee: Dow Corning CorporationInventors: Peng-Fei Fu, Eric Scott Moyer, Craig Rollin Yeakle
-
Patent number: 7695817Abstract: A thermally conductive grease includes (A) a polyorganosiloxane having a viscosity less than 50 cSt (mm2/s) at 25° C. and (B) a thermally conductive filler. The thermally conductive grease is useful as a thermal interface material for electronic devices.Type: GrantFiled: September 16, 2004Date of Patent: April 13, 2010Assignee: Dow Corning CorporationInventors: Zuchen Lin, Shizhong Zhang, Mark Fisher
-
Patent number: 7625687Abstract: This invention pertains to a silsesquioxane resin with improved lithographic properties (such as etch-resistance, transparency, resolution, sensitivity, focus latitude, line edge roughness, and adhesion) suitable as a photoresist; a method for in-corporating the fluorinated or non-fluorinated functional groups onto silsesquioxane backbone. The silsesquioxane resins of this invention has the general structure (HSiO3/2)a(RSiO3/2)b wherein; R is an acid dissociable group, a has a value of 0.2 to 0.9 and b has a value of 0.1 to 0.8 and 0.9?a+b?1.0.Type: GrantFiled: June 30, 2004Date of Patent: December 1, 2009Assignee: Dow Corning CorporationInventors: Sanlin Hu, Eric Scott Moyer, Sheng Wang, David Lee Wyman
-
Patent number: 7189664Abstract: A method for producing hydrogenated silicon oxycarbide (H:SiOC) films having low dielectric constant. The method comprises using plasma-assisted polymerization to react a cyclic silane compound containing at least one strained silicon bond to produce the films. The resulting films are useful in the formation of semiconductor devices.Type: GrantFiled: January 26, 2004Date of Patent: March 13, 2007Assignee: Dow Corning CorporationInventors: Mark Jon Loboda, Byung Keun Hwang
-
Patent number: 6971163Abstract: The attachment of an electrical component to an electrical termination on a component-carrying substrate by a solder bump technique of a thermally curable adhesive composition for encapsulating purposes is described which comprises a thermosetting polymer and a chemical cross-linking agent which has fluxing properties but which is unreactive or of severely restricted reactivity with the polymer without the action of heat and/or catalyst. The composition is to be thermally curable when heated to soldering temperatures in a reaction which is catalyzable merely by metal oxide fluxed from metal surfaces by cross-linking agent then dissolved in the thermosetting polymer.Type: GrantFiled: April 22, 1999Date of Patent: December 6, 2005Assignee: Dow Corning CorporationInventors: Hugh Patrick Craig, David John James Lowrie
-
Patent number: 6924346Abstract: Silicone resins comprising 5 to 50 mole % of (PhSiO3-x)/2(OH)x) units and 50 to 95 mole % (HSiO(3-x)/2(OH)x), where Ph is a phenyl group, x has a value of 0, 1 or 2 and wherein the cured silicone resin has a critical surface free energy of 30 dynes/cm or higher. These resins are useful as etch stop layers for organic dielectric materials having a critical surface free energy of 40 dynes/cm or higher.Type: GrantFiled: October 4, 2002Date of Patent: August 2, 2005Assignee: Dow Corning CorporationInventors: Ronald Boisvert, Stelian Grigoras, David Ha, Brian Harkness, Craig Yeakle