Abstract: A method for constructing a feedthrough via connection and a corresponding apparatus includes a metallic plate (101), or rigidizer, preferably composed of an aluminum material. A solderable contact area (103), is located on the plate (101). This contact area (103) is preferable comprised of a copper material selectively disposed by a plasma spraying process. Next, an electrically insulating adhesive layer (105) is disposed onto the plate (101). This adhesive layer (105) has a feedthrough via (106) disposed therethrough aligned with the contact area (103). Then, a substrate (109), preferably composed of a flexible composite polyimide material, is disposed onto the adhesive layer (105). This flexible substrate (109) has a via (110) disposed therethrough with a solderable area (111) disposed thereon.

Abstract: A crop frost prediction system (20) is provided. The system (20) exposes a thermally radiant surface (22) to atmosphere (26) and senses the temperature of the thermally radiant surface (22). The sensed temperation, alone or in combination with other variables, is used by a processor (38) to calculate whether frost is likely to occur. The system (20) capitalizes on the understanding of the inventor that the thermally radiant surface (22) will dissipate heat (24), and thus have a lower temperature than the ambient air, under conditions of low humidity and clear night sky.