Patents Represented by Attorney Smith-Hill Bedell

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  • Integrated circuit tester with high bandwidth probe assembly
    Patent number: 6917210
    Abstract: Described herein is a probe card assembly providing signal paths for conveying high frequency signals between bond pads of an integrated circuit (IC) and an IC tester. The frequency response of the probe card assembly is optimized by appropriately distributing, adjusting and impedance matching resistive, capacitive and inductive impedance values along the signal paths so that the interconnect system behaves as an appropriately tuned Butterworth or Chebyshev filter.
    Type: Grant
    Filed: December 29, 2003
    Date of Patent: July 12, 2005
    Assignee: FormFactor, Inc.
    Inventor: Charles A. Miller