Abstract: Methods and apparatus for providing connection packages for high-speed integrated circuits (“ICs”) in optical, electronic, wired or wireless communications are disclosed. The connection package achieves dimensional transformation of signal routes from high-speed, high-density IC's input/output pads to the external terminals such as coaxial terminals and BGA balls, while maintaining constant characteristic impedance throughout the transmission lines. A package may include a substrate having microstrips for communicating signals between the IC pads and external terminals. A pair of differential microstrips can be positioned closer to each other near the IC pads and create capacitive coupling. Such coupled capacitance allows the width of the microstrips to be reduced.

Abstract: Methods and apparatus for generating clock signals accurately locked to multi-gigabits-per-second data signals received over fiber optic channels are disclosed. The invention includes a phase detector for comparing a data signal and a clock signal, a one shot unit for detecting a data transition, an XOR, a filter, a main charge pump, a compensating charge pump for producing additive or compensating current, and a VCO for generating the clock signal. The phase detector includes multiple D-flip flops. The one shot unit includes a delay unit and an AND gate. The filter includes a resistor, a capacitor and a negative resistance amplifier. The main charge pump includes differential inputs, double outputs, cross-quading resistors, differential NPN input transistors, and a current source. The compensating charge pump includes differential NPN input transistors and a current source.