Patents Represented by Attorney Spivak, McClelland, Maier & Neustadt Oblon

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  • Resin composition
    Patent number: 5346950
    Abstract: A resin composition comprising 5 to 95 parts by weight of a saponified product of an ethylene-vinyl acetate copolymer (A) having an ethylene content of 20 to 60 mol % and a degree of saponification of at least 90% and 95 to 5 parts by weight of a styrene-based polymer (B) having mainly syndiotactic configuration. The resin composition has gas barrier properties and a markedly improved heat resistance.
    Type: Grant
    Filed: October 25, 1993
    Date of Patent: September 13, 1994
    Assignees: Kuraray Co., Ltd., Idemitsu Petrochemical Co., Ltd.
    Inventors: Taichi Negi, Akira Mochizuki, Shiro Nagata, Komei Yamasaki, Keisuke Funaki, Takashi Sumitomo
  • Encapsulation package for electronic component
    Patent number: 5196651
    Abstract: A package for the encapsulation of an electronic component (50) includes a bottom (40), lateral faces (41) positioned around a main axis of the package and an open face (42) opposite the bottom (40). Each lateral face (41) includes guides (48) for guiding connection wires (45) of the component (50). These guides (48) are distributed evenly around the main axis of the package. The sides of the bottom (40) are equal.
    Type: Grant
    Filed: November 30, 1990
    Date of Patent: March 23, 1993
    Assignee: Compagnie Europeenne de Composants Electroniques LCC
    Inventors: Michel Pageaud, Michel Dautriche