Abstract: A method and apparatus are described for making various packages that are easily assembled into arrays for use in small runs of articles that are to be stuffed in the packages. One type of package is particularly suitable for attachment to a header card another package is designed to facilitate the insertion of debit cards. An array of receptacles are formed and placed on a sheet and a pattern of adhesive formed on another sheet. The receptacles are registered with the pattern in such manner that top edges of the receptacles are in contact with and can pull of the adhesive so that the receptacles are conveniently placed on a header card. Several embodiments are shown and described.