Abstract: A method is provided for fabricating a receptacle connector for use in an IC card assembly wherein the receptacle connector is adapted for mounting generally at an edge of a circuit substrate. A housing is provided with an upper surface and a plurality of terminal-receiving passages in a dual row configuration extend parallel to the upper surface. The circuit substrate is adapted to be located a given vertical distance from the upper surface of the housing. A plurality of receptacle terminals are inserted into the passages with surface mount tail portions of the terminals projecting outside the passages. The vertical distance between the circuit substrate and the top of the housing is determined. The tail portions of the two rows of terminals initially project in a generally straight planar array from a rear face of the housing.