Abstract: Projecting leads (28) on a support container (16) for a mini-oscillator assembly (14) initially are straightened in perpendicular directions in a lead-straightening mechanism (48). The straightened leads (28) then are reverse-bent in a bending mechanism (50), utilizing contact pads (26) on a substrate (22) of the mini-oscillator assembly (14) as anvils, so that the lead outer end portions retain the assembly adjacent the support container and so that the lead outer end portions can be bonded to the contact pads. Seating of the lead outer end portions (59) firmly on the contact pads (26) is insured by a lead-seating mechanism 60. The lead-bending mechanism 50 also applies pressure to the substrate (22) in the lead-bending operation to cause uniform spreading of an adhesive material (33) between the substrate and the support container (26).