Abstract: Metallic surfaces are imparted to non-conductive or dielectric substrates by an electroless coating process comprising coating the surface of the substrate with a hydrous oxide colloid of non-precious metal ions preferably selected from the group consisting of cobalt, nickel and copper ions, reducing the selected metal ions to a reduced or zero valence state with a suitable reducing agent, and exposing the substrate to an electroless plating bath.
Abstract: Metallic surfaces are imparted to non-conductive or dielectric substrates by an electroless (chemical) coating process comprised of coating the surface of the substrate with colloids of catalytic non-precious metals wherein the metals are either part of an alloy or in the elemental state or a compound and wherein the colloidal compositions are prepared by a special method which renders the colloids a greater catalytic activity when used in the plating process.
Abstract: A method for the formation of novel colloidal catalytic electroless plating compositions comprises admixing a highly stable non active (weakly active) colloidal dispersion with a reactivity modifier. The admixture so formed is used in electroless plating processes wherein a substrate is contacted with the novel colloidal catalytic composition, rinsed, contacted with a reducing or activating solution (which may be optional) and then contacted with an electroless plating solution.