Abstract: A system and method for improved throughput of semiconductor wafer processing. In one aspect, a wafer carrier is provided having a flat zone capable of holding an additional lot of wafers for processing. In addition, a multiple fork wafer transfer mechanism is provided having a plurality of wafer forks for loading and unloading wafers in the wafer carrier at a reduced fork pitch.
Type:
Grant
Filed:
December 19, 2000
Date of Patent:
October 15, 2002
Assignee:
Infineon Technologies Richmond, LP
Inventors:
Brian M. Knapik, David K. Lawson, Gregory O'Lyn Proctor