Abstract: A driver circuit is provided which offers decreased input loading, increased output loading, and a high voltage output level corresponding to a logic-1. These results are achieved through the use of pull-up transistors and capacitive and resitive circuitry which allow bootstrapped voltages.

Abstract: Random logic circuitry (210) is laid out in a logic array (212) that has a plurality of row and column locations. The logic circuitry (210) implements a plurality of dynamic logic circuits, each logic circuit having a plurality of logic gate field effect transistors (224) each formed at a selected intersection of one of the row locations and one of the column locations. Elongate gate conductors (e.g., G, H, I) are formed at selected row locations in the logic array (212), each gate conductor provided as a gate for one or more of the logic gate transistors (224). A plurality of elongate second conductors (222) connect to selected ones of the sources or drains of the transistors (224) and to non-Boolean portions of the dynamic logic circuits. The non-Boolean portions are formed in an adjacent tile section (214) in the semi-conductor layer separate from the logic array (212).

Abstract: A chip carrier (34) having a peripheral edge (40), a bottom surface (42) and an inwardly directed arcuate connecting surface (44) is provided. The chip carrier (34) is connected to a printed wiring board (36) by solder (38). The solder (38) adheres to the metallized portion (46) on the chip carrier (34) and the metallized portion (48) on the printed wiring board (36). The connecting surface (44) allows stress to be more evenly distributed to reduce the occurrence of the cracks in the solder (38) which cause failure of the circuit.

Abstract: An orthogonal chip mount system module (10) comprising a base module (12), an interconnect chip (14), orthogonal slots (16) and semiconductor chips (18) is provided. The interconnect chip (14) is fixed to the base module (12) by high thermal conductivity epoxy. The semiconductor chips (18) are interference fitted into the slots (16). Solder pads (20) on the semiconductor chips (18) are aligned with solder pads (22) on the interconnect chip (14) and the system module (10) is then heated to the reflow temperature of the solder forming joints (24).