Abstract: A blinds slat has a major portion being strips of bamboo and a minor portion being one or more pairs of wooden strips that are located at or near opposite side extremities of the slat. The resulting composite bamboo and wooden slat as exemplary resistance to warping and other deleterious effects of exposure to sun and moisture. Also disclosed is a method for producing the slats that is particularly advantageous in avoiding environmental harm, in that only small amounts of wood are used.
Abstract: A security device for preventing theft of a disk such as a CD or DVD from a storage container having a base and a hinged lid, a pedestal including a button having retainers thereon that retract when the button is depressed for releasing the disk, and a wrapper holding the container closed. The device has a cap member and rearwardly extending flange and stem members. Release of the disk from the pedestal and removal of the disk through a slit made in the wrapper is blocked by the cap member preventing depression of the button, the flange member also positively holding the disk on the pedestal when the lid is deformed against the device. Preferably the device is releasably retained in a seated condition when the lid of the container is open. Also disclosed is a method for securing a disk container.
Abstract: A colorful decorative light is disclosed. The colorful light includes a length of flexible core provided with mini-bulbs and wires electrically connecting to the mini-bulbs, and a substantially transparent outer covering encasing the core. In addition, a colorful and transparent cladding is arranged between the core and the outer covering, in order to provide a fancy decoration.
Abstract: Disclosed is a method for enabling the contents of a first chamber to be moved into a second chamber without exposing either chamber to elements making particulate-producing sliding contact. In one aspect of the invention, the method includes providing a carrier for a vertically spaced array of articles such as semiconductor wafers and having a clamping device for clampingly holding each of the articles; locating the carrier within the second chamber; opening the carrier by moving a first portion of the carrier upwardly from a second portion or,he carrier without producing sliding contact within the second chamber; and releasing the a clamping device without producing sliding contact within the second chamber, whereby the articles are accessible within the second chamber.
Abstract: A snowboard with a recessed bottom and upturned edges is provided to house a specialized base. The base consists of a metal plate between the longitudinal edges of the bottom with a plastic coating over it. The base is slick when wet and resilient enough to resist blows and abrasion.
Abstract: An improved method of fabricating integrated circuit structures on semiconductor wafers using a plasma-assisted process is disclosed wherein the plasma is generated by a VHF/UHF power source at a frequency ranging from about 50 to about 800 MHz. Low pressure plasma-assisted etching or deposition processes, i.e., processes may be carried out within a pressure range not exceeding about 500 milliTorr; with a ratio of anode to cathode area of from about 2:1 to about 20:1, and an electrode spacing of from about 5 cm. to about 30 cm. High pressure plasma-assisted etching or deposition processes, i.e., processes may be carried out with a pressure ranging from over 500 milliTorr up to 50 Torr or higher; with an anode to cathode electrode spacing of less than about 5 cm.
Type:
Grant
Filed:
March 16, 1993
Date of Patent:
April 5, 1994
Assignee:
Applied Materials, Inc.
Inventors:
Kenneth S. Collins, Craig A. Roderick, Chan-Lon Yang, David N. K. Wang, Dan Maydan