Abstract: The invention relates to a leadframe for semiconductor packages and a mold for molding the semiconductor package. The leadframe of the invention reduces occurrences of chip-out and floating of a chip paddle upon singulation after encapsulation. The leadframe inner voids define a chip paddle. At least one end of an inner void extends outwardly beyond a dam bar to provide a flow under pathway for encapsulating material when the leadframe is engaged by a top mold. The top mold has a sill that is continuous, e.g. tetragonal in shape, such that encapsulating material must flow under the sill when the top mold is clamping the leadframe. Encapsulating material is flowed into a mold gate of the leadframe and under a portion of the sill to engulf the semiconductor chip within the cavity formed by the top mold and the leadframe.

Abstract: A valve stem sealed by a packing. A spigot applies an axial compression loading to the packing via a sleeve when bolts are tightened. A clamp attaches two parts of the valve body to each other with the bolts extending between the spigot and the clamp. The bolt and spigot provide an integral spring construction.