Patents Represented by Attorney Stetina Brunda Barred & Brucker

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  • Power semiconductor package with strap
    Patent number: 6873041
    Abstract: A semiconductor package and a method for fabricating a semiconductor package are disclosed. In one embodiment, the semiconductor package includes an exposed portion of a conductive strap at a package horizontal first surface and exposed surfaces of multiple leads at a package horizontal second surface. A power semiconductor die is mounted on a die pad connected to at least one lead having an exposed surface. Heat generated by the die within the package may be dissipated through thermal paths including the exposed surfaces.
    Type: Grant
    Filed: July 11, 2003
    Date of Patent: March 29, 2005
    Assignee: Amkor Technology, Inc.
    Inventors: Sean T. Crowley, William M. Anderson, Bradley D. Boland, Eelco Bergman