Abstract: A method (300) and a corresponding system for managing associations in the CIM model are proposed. An association is modeled by a particular class, which includes two or more references to other classes; the association is implemented by a corresponding provider. Whenever a management application (such as a performance monitor) needs to access the association, a corresponding request is transmitted (309) to the provider. In response thereto, the provider enumerates (315) all the resource objects instantiating the references of the association, and creates (324) an instance of the association for any combination. In the method of the invention, the provider further sets (318,327) a property of each instance of the association, according to dynamic characteristics of the corresponding resource objects. In this way, an active association is provided, allowing cross-analysis of the resource objects participating in the association.

Abstract: Mechanisms for inferred discovery of a data communication device connected to a router, unreachable by a management module, and characterized by a device address are disclosed. The mechanisms include querying, by the management module, the router for connection data and identifying, by the management module in dependence upon the connection data, the device address.

Abstract: An example of a solution provided here comprises: performing a spending simulation, process simulation, information technology simulation, and value simulation, providing interactions among the simulations, and representing with the simulations the use by a client organization of one or more business transformation outsourcing services, such as sourcing, procurement, and payables.

Abstract: A system and method for ensuring the migratability of circuits into future technologies while minimizing fabrication costs and maintaining or improving power efficiency are provided. A mask layer is introduced to portions of the integrated circuit prior to a stress inducing layer being applied to the integrated circuit. In an exemplary embodiment of the present invention, a tensile or compressive film is applied to the devices on the integrated circuit chip but is removed from those devices whose operation is to be modified. Thereafter, a tensile or compressive strain layer is applied to the devices whose film was removed. An additional mask layer may then be used to effect a halo or well implant to relax the strain on the devices not being protected by the mask layer. In this way, the current of the non-protected devices is reduced back to its original target design point.