Patents Represented by Attorney, Agent or Law Firm Steven L. Hultquist
  • Abrasive free formulations for chemical mechanical polishing of copper and associated materials and method of using same
    Patent number: 6800218
    Abstract: An abrasive free formulation for chemical mechanical polishing and method for using the formulation for polishing copper and related materials. The abrasive free formulation has a high removal rate on copper and a low removal rate on barrier material. The abrasive free formulation comprises at least an oxidizing agent and an activating agent.
    Type: Grant
    Filed: August 23, 2001
    Date of Patent: October 5, 2004
    Assignee: Advanced Technology Materials, Inc.
    Inventors: Ying Ma, Michael Jones, Thomas H. Baum, Deepak Verma, David Bernhard