Abstract: The invention is a multiple size workpiece positioning device for the precise positioning or centering of workpieces, such as semiconductor wafers, in a processing station. The inventive includes a plurality of ring bars that may be pivoted on one end. The distal end of the ring bars form a circular shape that may decrease or increase in diameter as the ring bars are pivoted. This movement may be used to position or center the workpiece. A single combination pin or two pins of different heights may be mounted on the distal end of the ring bars. A combination pin or a rest pin and an alignment pin may be used to support the bottom of the workpiece to provide a contact point for an urging force on the edge of the workpiece.