Abstract: While an ultrasonic wave beam producing device scans an ultrasonic wave beam 5 across a semiconductor integrated circuit chip 2, a current through the circuit chip is detected. In this way, the semiconductor integrated circuit chip may be accurately tested, and the creation of electron-hole pairs is avoided.
Abstract: A magnetic recording medium is disclosed which is comprised of a non-magnetic support having thereon a magnetic layer comprising a ferromagnetic powder dispersed in a binder. The binder is comprised of a copolymer of vinyl chloride-vinyl acetate-vinyl alcohol and a copolymer of ethylene-vinyl acetate which is graft-polymerized with vinyl chloride and, optionally, a polyisocyanate. The recording medium has excellent electromagnetic properties, running properties and durability.