Abstract: High performance, low viscosity hot melt adhesives are obtained using acrylic block copolymers. The level of acrylic block copolymer in the adhesive formulation is less than 50% by weight.

Abstract: A process for the preparation of pressure sensitive adhesive tapes where cationic cure is conducted against liners and substrates with low moisture content and in an environment where moisture ingress during cure is prevented.

Abstract: A low application temperature rubber-based hot melt adhesive having properties particularly well suited for use in the construction of disposable articles has been invented. The adhesive comprises a styrene block copolymer and a type of wax in an amount effective to produce a viscosity at 120° C. of below about 10,000 centipoises, a cube flow at 130° F. (54° C.) of less than about 300%, a DSC crystallization temperature of less than about 75° C. and a storage modulus of less than about 1.0×107 dynes/cm2 at 10 rads/sec (25° C.).

Abstract: Hot melt adhesive compositions containing radial polystyrene-polyisoprene/polybutadiene block copolymer and use as elastic attachment adhesive in the manufacture of disposable absorbent elastic articles.

Abstract: Reactive hot melt adhesives compositions with long open time and/or high green strength are prepared by the use of urethane diols. These results are achievable at moderate/low application viscosity or low application temperature.

Abstract: A polyurethane hot melt adhesive composition comprising an isocyanate, one or more polyols, one or more bituminous materials and optionally one or more thermoplastic materials. Another embodiment is directed to a method for bonding materials together which comprises applying the reactive hot melt adhesive composition in a liquid form to a first substrate, bringing a second substrate in contact with the composition applied to the first substrate, and subjecting the applied composition to conditions which will allow the composition to cool and cure to an irreversible solid form, said conditions comprising moisture. Still another aspect is directed to an article of manufacture comprising the adhesive.

Abstract: The present invention discloses encapsulant materials for use in glob top and/or dam and fill applications comprising base oligomer/monomers preferably having an acrylated/methacrylated or vinylene-containing oligomer/polymer, one or more multifunctional acrylate monomers, one or more thixotropic agents and, optionally, fillers, additives, photoinitiators and/or pigments. The encapsulant has low levels of water absorption and shrinkage.

Abstract: A radio frequency identification (“RFID”) system antenna having adhesive pre-applied to one or more of its contact pads to allow for high speed attachment of the antenna to the RFID die or die strap. Also disclosed is a method for attaching an RFID antenna having pre-applied adhesive to a die or die strap.

Abstract: A low stress conductive film or paste adhesive that comprises a) one or more functional acrylic copolymers or terpolymers; b) epoxy; and c) conductive filler. Additional ingredients, such as adhesion promoters and conductivity enhancers may also be utilized. The conductive film or paste adhesive provides higher adhesion strength than traditional flexible conductive film adhesives and a lower stress between the bonded components than existing high adhesion strength conductive films.

Abstract: A cross-linkable and cross-linked organosilicon polymer which is prepared from a mixture of a reactive polysiloxane resin having both reactive carbon-carbon double bonds and silicone-hydrogen groups, characterized by alternating structures of polycyclic polyene residue and cyclic (or tetrahedral) polysiloxane residue, and either vinyl terminated fluorine-containing polysiloxane or vinyl terminated phenyl-substituted siloxane. In an alternative embodiment, the polymer comprises a mixture of vinyl terminated phenyl-substituted polysiloxane and vinyl functional fluorosilicone elastomer with the cross-linkable and cross linked organosilicon polymer.

Abstract: A hot melt adhesive based on ethylene-2-ethylhexyl acrylate copolymer finds use in packaging applications where high heat resistance, as well as good cold tolerance, is required.

Abstract: A hot melt adhesive comprising an adhesive polymer and a modified rosin-terpene, preferably a phenol modified rosin terpene. The adhesive is particularly useful in packaging applications.